xiX-XL
MX1510MR-SY-X4G3-FF

Large sensor BSI camera with 150.8 Mpix Monochrome Medium format SONY IMX411

Product statusEngineering-Sample 
Sensor vendorSONY 
Sensor modelIMX411 
Sensor technologyCMOS 
Shutter typeRolling shutter, Global reset release 
Frame rate6.2 FPS
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Overview
Get all the important facts about the camera model you have selected. Additional information is available in the camera family manual, the support sites or directly from our sales team.
Highlight_Compact
COMPACT
The ratio of the camera’s size and weight to focal plane area is the best in its class. Camera dimensions are as close to sensor size as possible.
Highlight_Efficient
EFFICIENT
Large Sony sensors are absolutely remarkable in their imaging qualities, offering quantum efficiency up to 90 % thanks to the backside illuminated design.
Highlight_Functional
FUNCTIONAL
Based on the sensor functionality, the cameras utilize a full range of features making it possible to select 12, 14 or 16 bit readout as well as 2x2 or 3x3 Binning and ROI
Highlight_Adaptable
ADAPTABLE
The removable sensor head can be detached from the main camera electronics minimizing the effects of heat while still minimizing read noise to the 1e- range.
Specification
Sensor properties
Resolution 150.8 MPix
Sensor resolution 14176 x 10640
Sensor vendor SONY
Sensor model IMX411
Sensor type Monochrome
Sensor technology CMOS
Sensor size Medium format
Sensor active area 53 x 40 mm
Sensor diagonal 66.6 mm
Pixel size 3.76 µm
Shutter type Rolling shutter, Global reset release
Camera properties
Frame rate 6.2 FPS
Bits 12, 14, 16 bits
On-chip downsampling 2x2
Interface PCIe Gen 3
Data interface speed 32 Gbit/s
Data connector type PCIe-FireFly-X4G3
GPIO count Inputs: 6, Outputs: 6
Exposure minimum 90 µs
Exposure maximum 12 s
Power consumption 14.1 Watt
Heat dissipation Fan air cooling
Sensor cooling No
Special features Taped glass, Backside illumination
Internal memory 2 GB
EMVA 1288 results
Dynamic range 78 dB
Saturation Capacity 50000 e-
Readout noise 1 e-
Gain analog max 36 dB
Mechanical properties
Lens mount M72 mount, Hasselblad mount
Enclosure type Standard housing
Physical dimensions (WHD) 80 x 80 x 45.1 mm
Mass - weight 455 gram
Ambient operating temperature 0 - 50 °C
Storage Temperature -25 - 60 °C

Feature set for xiX family

Technology

 
Sensor technology CMOS, BSI - Backside illuminated
Bandwidth 32 Gbits over PCIe Gen3 x4 lanes
Acquisition Modes Continuous, software and hardware trigger, fps limiting, triggered exposure and burst
Digital Output 12, 14, 16 bit RAW pixel data digitization
Interface Flexible flat ribbon copper cable and fiber cable options of PCIe connector
General purpose I/O 2x optoisolated input, 2x optoisolated output, 4 non-isolated input-outputs
Synchronization Hardware and software trigger input, exposure strobe output, busy output
Lens mount Passive M72 mount, active EF mount with Lens Control – focus, iris, image stabilization

Processing

 
Partial image readout ROI / AOI (region / area of interest); Skipping and Binning modes supported - model specific
Image processing Host based de-Bayering; sharpening; Gamma; color matrix; true color CMS;
lookup table (LUT); hue; saturation; sharpness; white balance
Hot pixel correction On camera storage of up to 5000 pixel coordinates; host assisted correction
Auto adjustments Auto white balance; auto gain; auto exposure; HDR (High Dynamic range)
Flat field corrections Host assisted pixel level shading and lens corrections
Signal conditioning Programmable debouncing time
Latency Computer CPU is not involved in data transfer, latency from camera to memory is minimal

Software

 
SDK / API Programmable with C++ and C#, Python
Software support one API / SDK for all cameras, adapters and drivers for various image processing Libraries
Viewer programs CamTool viewer
Firmware updates Field firmware update through xiCOP tool

Computer

 
Operating systems Windows 10 (x86 and x64), Linux Ubuntu, ARM, MacOS 10.8 and newer, NVIDIA Jetson modules
Minimum host hardware Intel i5 3.0GHz, +2GB RAM physical memory, Motherboard with PCIe x4 Gen3

Regulations

 
Environment side Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage
Conformity CE, FCC, RoHS, GenICam/GenTL, PCI Express External Cabling Specifications compliant

Applications for high resolution large sensor xiX-XL cameras

Aerial-mapping
Aerial mapping
Photogrammetry, Videogrammetry - city street or outdoor 3D mapping, Wide area motion imaging, stadium and border surveillance.
Portable-drone-vehicle
Portable
Autonomous, self-driving, Unmanned aerial vehicles (UAV) and Unmanned aircraft systems (UAS), Advanced driver assistance systems (ADAS), drones.
Broadcasting
Broadcasting
Cinematography, Entertainment, Instant replays and rapid process capturing, e.g. golf, hockey, ping pong, baseball, tennis, football, basketball and more.
Flat-panel-display
Quality inspection
Flat panel display (FPD), Printed circuit board (PCB) examination, Solar panel, Photovoltaics, Semiconductor wafer, Metrology, Print and Film scanning.
Variants
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Accessories
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