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New XUV and soft X-ray camera models of sCMOS cameras

XIMEA releases sCMOS scientific grade camera models with Gpixel GSENSE400 BSI Pulsar
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Muenster, Germany, MAY 2023 – As part of its xiLAB initiative, XIMEA expands the xiJ family of cooled sCMOS cameras with models for XUV and Soft X-ray imaging.
 
For a long time, the diffraction limit defined by Ernst Abbe defined the natural barrier that restricts the resolution of small objects.
To overcome this limitation multiple techniques like STED, STORM, PALM, TEM or others were developed, using advanced illumination and detection technologies.
 
In its original sense, the Abbe limit states, that the shorter the wavelength of the particle, the higher the resolution.
Therefore the observability to resolve small structural features in the image is also higher.
 
This fundamental law applies to visible light and to all photons of the electromagnetic spectrum.
That includes the high energy containing photons of extreme UV (XUV), roentgen radiation (Xray), and electrons.
 
While the diffraction limit is still valid, using XUV (CWL: 13.5nm), soft-Xray, and high energy containing electrons, it is possible to push the resolution higher.
Thus, enabling to resolve the fine structural features and dynamics in biological processes (cells, human body) as well as materials. 
 
 

XIMEA’s solution

 

To fulfill these needs and leverage the high potential of XUV/soft-Xray, XIMEA added a new MJ042MR-GP-P11-BSI-UV model to the scientific portfolio of cameras.
The model is equipped with the new Gpixel GSENSE400BSI-UV (PulSar) sCMOS sensor that is combined with Peltier cooling and USB3 interface.
 
The camera body is extended by a standard DN 63 CF vacuum flange. Additional flange formats are available upon demand. 
By using the new Pulsar sensor the spectral range is extended from IR, VIS, and UV into the soft-Xray regime, covering a maximum range from 0,5 to 1000 nm.


Main specifications of the new MJ042 Pulsar models:
MJ042MR-GP-P11-BSI-UV: 4.2 Mpix, Gpixel GSENSE400 BSI, backside illuminated monochrome, 2048 x 2048, 11 μm pixel, 2" with TEC and USB3
MJ042MR-GP-P6-BSI-UV: 4.2 Mpix, Gpixel GSENSE2020 BSI, backside illuminated monochrome, 2048 x 2048, 6.5 μm pixel, 1.2" with TEC and USB3

Wavelength sensitivity ranges:
Soft X-ray: 0.2 - 12 nm (0.1 – 5KeV)
XUV, EUV: 10 - 124 nm (<0.1Kev @ cw:13.5nm)
 
 

Advantages

 

Unique selling proposition

Fast image acquisition and high framerates - 48 FPS
​​​​Compact
Simple USB interface
Peltier cooling - Exceptional temperature stability (indium gaskets etc.)
Custom sensor timings
Modified sensor chamber, no outgassing, protected electronics

 

Overall benefits

High Quantum efficiency up to 99%
Dynamic range in HDR mode of above 95 dB
Low noise around 1.7 e-
High Full Well Capacity - up to 128K e-
Improved axial-lateral resolution
Vacuum compatibility (exposed sensor)

 

Applications

 
The wide pool of possible applications for this kind of detector ranges from Astronomy to nanotechnology throughout industrial and life science applications.
 
The industry demands new technologies to shrink the size of electronic components and increase their quality through coherent diffraction imaging techniques.
Science on the other hand requires this radiation to overcome the diffraction limit and resolve even smaller structural features. 
 
For both, XIMEA developed a new camera operating with high sensitivity in Soft Xray spectroscopy and tomography.
Moreover, many chemical gases, as well as biological relevant molecules, have spectral signatures in the soft-Xray and UV regime.
 
Thus, these cameras are well suited to visualize and quantify mesoscale biology in the plane and 3D-image reconstruction and other applications like:

 

XANES

X-PEEM

STXM

EUV lithography

NEXAFS

UVRR

X-ray absorption near edge structure spectroscopy

X-ray photoemission electron microscopy

Scanning transmission x-ray microscopy

Semiconductor metrology

Near Edge X-ray Absorption fine structure

UV Resonance Raman spectroscopy

Hyperspectral

Forensic

Solar imaging

Correlative microscopy

Additive manufacturing

FIB/SEM: 3D imaging

Soft X-ray Water Window Tomography

Atmospheric chemistry/ composition

XUV ptychography and spectrometry

Electron detection imaging

Phase contrast imaging

 

 

Contact us for more information. We'll be happy to help.

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