xiMU
MU181CR-ON

Miniature camera with 18 Mpix Color onsemi AR1820HS CMOS sensor and USB3 interface

Product statusActive 
Sensor vendoronsemi 
Sensor modelAR1820HS 
Sensor technologyCMOS 
Shutter typeRolling shutter, Global reset release 
Frame rate21 FPS
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Overview
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Highlight_Precise
PRECISE
High-resolution sensors up to 19.6 Mpix with backside illumination
Highlight_Smallest
SMALLEST
Fits into places where no other comparable camera can fit
Highlight_Light-weight
LIGHT-WEIGHT
Payload-friendly SWaP for mobile, robotics, gimbals, or UAV/UAS applications
Highlight_Adaptable
ADAPTABLE
Easy to use with a choice of connections like type-C, incredibly compact flex ribbon cable or micro-coax
Specification
Sensor properties
Resolution 18 MPix
Sensor resolution 4896 x 3680
Sensor vendor onsemi
Sensor model AR1820HS
Sensor type Color
Sensor technology CMOS
Sensor size 1/2.3"
Sensor active area 6.1 x 4.6 mm
Sensor diagonal 7.7 mm
Pixel size 1.25 µm
Shutter type Rolling shutter, Global reset release
Camera properties
Frame rate 21 FPS
Bits 12 bits
On-chip downsampling 1x1, 2x2
Interface USB3
Data interface speed 5 Gbit/s
Data connector type USB3 Type-C
GPIO count Inputs: 3, Outputs: 3
Exposure minimum 300 µs
Exposure maximum 3 s
Power consumption 1.48 Watt
Heat dissipation Natural convection
Sensor cooling No
Special features Smallest size, Backside illumination
EMVA 1288 results
Dynamic range 57.6 dB
Saturation Capacity 4500 e-
Readout noise 6 e-
Signal to noise ratio 36.3 dB
Peak QE red 63% 600nm
Peak QE green 70% 540nm
Peak QE blue 56% 470nm
Gain analog max 24 dB
Spectral Range 400 - 1000 nm
Mechanical properties
Lens mount S-mount
Enclosure type Standard housing
Physical dimensions (WHD) 15 x 15 x 14 mm
Mass - weight 5.1 gram
Ambient operating temperature 0 - 50 °C
Storage Temperature -25 - 60 °C

Feature set for xiMU family

Technology

 
Sensor technology CMOS
Acquisition modes Global shutter and Rolling shutter
Digital Output 8, 10, 12 bit RAW pixel data digitization
USB 2.0 interface Micro connector with USB 2.0 High-speed and digital I/O
USB3 Interface USB 3.1 Gen1 with Type-C connector or flexible flat ribbon connector for embedded vision systems
General purpose I/O 4x IO configurable as input or output
Synchronization Hardware trigger input, software trigger, exposure active, frame active, trigger ready, exposure active pulse, busy
Power requirements 0.76 Watt supplied via USB 2.0 interface, 1.4Watt supplied via USB 3.0 interface
Lens mount Standard S-mount (M12), two lens mount adapters available, and board level version

Processing

 
Partial image readout ROI / AOI (region / area of interest); Skipping and Binning modes supported
Image processing Host based de-Bayering; sharpening; Gamma; color matrix; true color CMS; lookup table (LUT); hue; saturation; sharpness; white balance
Hot pixel correction On camera storage of up to 5000 pixel coordinates; host assisted correction
Auto adjustments Auto white balance; auto gain; auto exposure
Flat field corrections Host assisted pixel level shading and lens corrections
Signal conditioning Programmable debouncing time

Software

 
SDK / API Programmable with C++ and C#, Python
Software support one API / SDK for all cameras, adapters and drivers for various image processing Libraries
Viewer programs CamTool viewer
Firmware updates Field firmware update through xiCOP tool

Computer

 
Operating systems Windows 10 (x86 and x64), Windows 7 SP1 (x86 and x64), Linux Ubuntu, MacOS 10.8 and newer
Minimum host hardware Intel i3 3.0GHz, +2GB RAM memory, NVIDIA or Radeon 128MB, compatible USB host adapter

Regulations

 
Environment side Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 70°C storage, Ingress Protection: IP40
Conformity CE, FCC, RoHS, WEEE, GenICam/GenTL, Universal Serial Bus Specification

Miniature xiMU camera Industries and Applications

Miniature-glasses-dentist-white
Miniature
Stop motion animation, HMC - head mounted camera, Kiosks, Robotic arms, Face recognition, Eye Tracking, 3D Body scanner, People counting, security.
Microscopy
Medical and Scientific
Ophthalmology and Retinal imaging, Material and Life science microscopy, Differential interference contrast (DIC), Dentistry, Biometrics and Cell biology.
Aerial-mapping
Aerial mapping
Photogrammetry, Videogrammetry - city street or outdoor mapping with UAV / UAS and other types of drones or self-driving vehicles.
Quality-inspection
Quality inspection
Flat panel display (FPD), Printed circuit board (PCB) examination, Solar panel, Photovoltaics, Semiconductor wafer, Metrology, Print and Film scanning.
Variants
More flavors, more options: Explore alternative versions of the selected model.