Besides the standard products from portfolio, XIMEA always actively seeks opportunities to provide additional services based on the considerable skillset of the RnD team.
During almost 30 years of hands-on experience, the XIMEA technicians assembled knowledge about a wide range of various technologies and methods to integrate them for different purposes.
This section of the webpage is focused on the structural re-designs of the standard products that can considerably affect the parameters of the product or the whole set of suitable applications.
These structural variations present a set of optional advantages that were not only prototyped, but already tested by pilot customers or even included into the regular selection of camera versions.
BENEFITS
Wider range of applications
Full speed potential
Suitable for Embedded vision
Longer exposure times
Sensor modification
Portfolio - CMOS or sCMOS, high speed and sensitivity sensors
Optional - direct scintillator coupling for X-ray imaging applications
Interface bandwidth
Portfolio - USB 2.0 and USB 3.1 Gen1 bandwidths
Optional - PCIe Gen2 or Gen3 with 20 and 64 Gbit/s respectively
Enclosure types
Portfolio - sturdy and compact full metal housing
Optional - even smaller board level modules for system integration
Cooling methods
Portfolio - passive cooling with additional Heatsinks or Fans
Optional - Thermoelectric Peltier modules with possible Water dissipation
